Two-part adhesive bonding compositions comprising an epoxy resinous material and a poly-amido amine



- polyamine ispresent in the resulting copolymer.

United States Patent Office 14 Claims. (Cl. 260-18) This application is a division of my copending application Serial No. 48,359, filed August 9, 1960, now Patent -No. 3,140,566, issued July 14, 1964.

The present invention relates to epoxy resin adhesive compositions which are compatible with water. More particularly the present invention relates to epoxy resin compositions which produce a hard, cured; resin in the presence of water. 3

Prior to the present invention, workers skilled in the epoxy resin adhesive composition art were steadfast in requiring that water be eliminated from both the components of the epoxy resin compositions and the surfaces to which it was to be applied. This was so because hereto- ;fore epoxy resin adhesives containing water did not cure hard and integrally strong. Moreover, the epoxy resin adhesive compositions heretofore known did not form a satisfactory bond when applied to wet surfaces or to surfaces which had a film of water onthem.

Another disadvantage of the epoxy resin adhesive compositions heretofore known resides in the ditliculty of removing these compositions from surfaces to which they have been applied. When such compositions are used to set tile, for example, costly andoften noxious organic solvents had to be used to remove the adhesive compositionfrom the tile surfaces.

It isan object of the present invention to provide epoxy resin adhesive compositions which cure in the presence of water.

It is a further object of'the present invention to provide epoxy resin adhesive compositions which may be emulsified in and readily removed by water.

A further object of the present invention is to provide epoxy resin adhesive compositions which are compatible with water, so that water may be added as a diluent to adjust the viscosity of the adhesive composition, thereby improving the workability of the composition.

A still further object of the present invention is to pro vide'a method for setting tile with epoxy resin adhesive compositions without the need for either protecting the surface of the tile from contact with the adhesive composition; or for using costly and noxious organic solvents to remove the adhesive compositions from the tile surface.

Other objects of the invention will be clear from the following description.

The epoxy resin adhesive compositions of the present invention comprise epoxide resin polymers or monomers, and poly-amido-amine epoxy hardeners.

The poly-amido-amine epoxide hardeners are produced by copolymerization of polyamines with polycarboxylic acids, the copolymerization reaction being permitted to proceed to such an extent that the products produced are soluble in both epoxy resin and water.

In conducting the copolymerization reaction, it is important that excess polyamine be used, so that unreacted In the case where no unreacted amine remains, water solubility is lost and the products do not possess the required ability to harden an epoxide polymer. Nor are such reaction products soluble in the epoxy resin and water.

Patented May 11, 1965 As has been noted hereinabove, suitable amine hardeners are prepared by reacting the polyamines and polycarboxylic acids described herein at temperatures below the decomposition temperaturev of the polyamines by employing the appropriate polyamine in stoichiometric excess of that theoretically required to react with the appropriate polycarboxylic acid. The temperature of the reaction is preferably between about and 200 C. Especially good results are achieved when the tempera-.

ture is between about and C.

In accordance with the present invention, aliphatic polyamines containing two or more amino nitrogens may" where R is a hydrocarbon radical and n is an integer having a value of at .least 2, and preferably between about 4 and 10. Such polyamines should'ihave a formula weight of at least 60 and preferably between about 90 and 500.

Examples of polyamines that may be used include ethylene diamine, propylene. diamine, diethylene tr amine, dipropylene triamine, triethylene tetramine', tripropylene tetramine, tetraethylene pentamine, tetrapropylene pentamine, and mixtures of the foregoing. Also may be mentioned higher alkyl polyamines satisfying the above formulae, such as alkyl polyamines in which the alkyl group is butyl hexyl, octyl and so forth. The hydrocarbon radical R attached to the amino-.mitrogen atoms may have up to 50 carbon atoms or mire. Preferably, however, the hydrocarbdh radical has fewer than about 30 carbon atoms.

Especially suitable are polyamines which have a value of n of at least 4', or polyamines wherein the formula weight of R is greater thanabout 90. It has been found that where polyamines are usedin which n is an integer less than 4, or R is of a molecular weight lower than 90, satisfactory hardening action is not obtained. This is believed to be due in part to the reaction of such low molecular weight polyamines with polycarboxylic acids to form compounds having a high melting point, which compounds require high reaction temperatures, e.g., above the decomposition temperature of the polyamines, tofelfect the fusion which precedes the amidation reaction. The same problems are experienced when, for example, a 'polycarboxylic acid, e.g.,' -R(COOH) is employed wherein R is of low molecular weight. A further difficulty found to exist when low molecular weight poly amines and polycarboxylic acids are used is that the reaction products produced are insoluble in epoxidepolymers and therefore are not able to function as hardeners. The polycarboxylic acids suitable for reaction with the above described polyamines to produce the poly-' amide-amine epoxide hardeners of the present invention have at least two carboxyl groups and may be represented by the formula R(CO0H),,, where R is a hydro called resin acids. These may be classified as diterpene acids, a major constituent being abietic acid. When such diterpene acids are dimerized, a dicarboxylic acid results. Particularly useful are those diterpene acids which, upon being dimerized, have a formula weight of about 300 to 900, and preferably between about 500 to 600.

The poly-amido-amine epoxide hardeners of the present invention are produced by dissolving the polycarboxylic acid and polyamine in a suitable organic solvent, in which the polyamine and the polycarboxylic acid are soluble. The amount of the polyamine isin excess of that stoichiometrically required to react with the polycarboxylic acid. The amount of excess polyamine is preferably at least about percent, and may be between about 5 and 100 percent, or higher, based on the polycarboxylic acid. The solvent employed is not critical, since after mixing the solvent is preferably removed, for example by evaporation. The residue remaining after solvent evaporation is then heated to a temperature of between about 100 to 200 C., care being taken that the temperature employed is below the decomposition temperature of the polyamine used. The time of heating should be at least about one-half hour, or between about 1 and hours, and is preferably between about land 16 hours. Although the solvent is preferably removed prior to heating, it should be understood that the solvent may also be removed after heating.

The resinous epoxides suitable for use in the present invention comprise those compounds having at least two epoxy groups, i.e., at least two groups. The polyepoxides may be saturated or unsaturated, aliphatic, cycloaliphatic, or heterocyclic and may be substituted if desired with substituents such as chlorine atoms, hydroxyl groups, ether radicals, and the like. They may also be monomeric or polymeric.

Examples of the polyepoxides include, among others, epoxidized glycerol dioleate,

l l,4-bis(2,3-epoxypropoxy) benzene, l,3-bis(2,3-epoxypropoxy) benzene, 4,4-bis(2,3-epoxypropoxy) diphenyl ether, 1,8,-bis(2,3-epoxpropoxy)-octanc, 1,4-bis(2,3-epoxypropoxy)-cyclohexane, 4,4-bis 2-hydroxy-3 ,4'-epoxybutoxy diphenyldimethylrnethane, 1,3-bis(4,5'epoxypentoxy)-5-cl1lorobenzene, 1,4-bis(3,4-epoxybutoxy)-2-chlorocyclohexane, 1,3-bis(2-hydroxy-3,4-epoxybut0xy) benzene, 1 ,4-bis and (2-hydroxy-4,5-epoxypentoxy) benzene.

epoxides may be further exemplified by 3-chloro-l,2- epoxybutane, 3-bromo-l ,2 epoxyhexane, 3 chloro 1,2- epoxyoctane, and the like.

The monomer products produced by this method from dihydric phenols and epichlorohydrin may be represented by the general formula:

wherein R represents a divalent hydrocarbon radical of the dihydric phenol. The polymeric products will generally not be a single simple molecule but will be a como plex mixture of glycidyl polyethers of the general formula:

wherein R is a divalent hydrocarbon radical of the dihydric phenol and n is an integer of the series 0, 1, 2, 3, etc. While for any single molecule of the polyether n is an integer, the fact that the obtained polyether is a mixture of compounds causes the determined value for n to be an average which is not necessarily zero or a whole number. The polyethers may in some cases contain a very small amount of material with one or both of the terminal glycidyl radicals in hydrated form. 1

The aforedescribed glycidyl polyethers of the dihydric phenols may be prepared by reacting the required proportions of the dihydric phenol and the epichlorohydrin in an alkaline medium. The desired alkalinity is obtained by adding basic substances, such as sodium or potassium hydroxide, preferably in stoichiometric excess to the epichlorohydrin. The reaction is preferably accomplished at temperatures within the range of from 50 C. to 150 C. The heating is continued for several hours to effect the reaction and the product is then washed free of salt and base.

These epoxide resins are available in several forms varying from a viscous liquid to a solid resin. Especially suitable are those resins which are liquid or near their softening point at room temperature.

Typical of the epoxy resins which may be employed are the epichlorohydrin-bis-phenol type sold under the trademarks Epon Resins, Gen Epoxy, DER Resins," ERL Resins, Epi-Rez; the peracetic acid-epoxidized compounds sold under the trademark Unox Diepoxides; and the trifunctional epoxy compounds sold under the trademark Epiphen. An example of the trifunctional type of compounds is Epiphen ER-823, which has the following formula:

To produce the adhesive compositions, the poly-amidoamine hardening agent produced as described hereinabove is mixed with either a liquid or solid epoxide resin. The amount of the hardened amine derivative mixed with the epoxy resin is capable of some variation. In general, it will vary from about 5 to 200 percent by weight of the epoxide resin, and is preferably from about 50 to percent by weight of the epoxide resin.

When liquid epoxide resin compositions are used, the adhesive compositions may be produced by simply dissolving the hardener in the liquid epoxide resin. When The prime poly-amido-amine hardener was prepared by dissolving 14.6 parts by weight of adipic acid in 100 parts by weightof ethyl alcohol and to this mixture were added 40.0 weight parts of N-octadecene trimethylene diamine. After solution was effected, the resulting mixture was heated to evaporate the alcohol, then placed for 16 hours in an oven held at 120 C. Upon cooling an orange-brown paste was obtained. This was slowly soluble in an equal weight of water yielding a gelatinous solution.

The epoxide polymer used was of the epichlorohydrinbisphenol of acetone type, having a viscosity of about 13,000 centipoises (25 C.), an epoxide equivalent of approximately 200, and a melting point in the range of 8 to 12' C. The epoxide polymer was a complex mixture of glycidyl polyether and had the following general formula: v v

The orange-brown paste produced was added to an ,equal weight of the liquid epoxide polymer described hereinabove. An adhesive composition which hardened on standing was obtained.

The adhesive composition was effectively and readily hardened in the presence of water, and was capable of being readily removed from surfaces upon application of a water-soaked cloth.

Example II An adhesive composition was prepared by dissolving N-octadecene trimethylene diamine in an equal weight of the liquid epoxy resin polymer described in Example I. The resulting compositionQdid not readily or effectively harden in the presence of water and aqueous alkali and acid solutions. Nor was it removable from a surface by application of a water-soaked cloth.

Example III Following the procedure of Example I, stoichiometric amounts of dimerized tall oil resin were reacted with the following amines by heating at 155 C. for 1 hour:

Ethylene diamine Diethylene triamine Tetraethylene pentamine N-alkyl. (C trimethylene diamine The products of these reactions were added to an equal weight ofi'ithe liquid epoxide resin described in Example I. The resulting adhesive compositions did not effectively harden, and did not exhibit the water-cleanability characteristic of the adhesive compositions of Example I.

Example IV Example III was repeated, except that in preparing the amine hardener, the amines were added to the 'dimerizedalkyl group content 6 Example V The procedure of Example I was followed, but with substitution of an epoxide resin of the epichlorohydrin-bisphenol of acetone type having an epoxide equivalent of about 185 and a viscosity of approximately 7,000 centipoises (25 C.). The resulting composition was more fluid than that obtained in Example I, and again showed the same water-cleanability characteristic, and good hardening characteristics of the composition produced in Example I.

Example VI The procedure of Example I was followed but with substitution of a solid epoxide polymer of the epichlorohydrinbisphenol of acetone type.v The solid epoxide resin was dissolved in phenyl glycidyl ether, at a 4:1 resinzether ratio. The epoxide polymer had a melting point of about 42 C. and an epoxide equivalent weight of 500. The resulting composition had properties similar to those obtained in Example I.

Amines in the form of their acidsalts may also be used in the present invention. Examples of these are the materials Duomeen O and Duomeen S. ,Duomeen 0" consists essentially of a mixture of N-alkyl trimethylene diamines derived from technical grade oleic acid.. The

is distributed approximately as follows:

Percent C-14 2 C-16 5 C-18 93 Percent C-16 13 C-18 87 Example VII -10 weight parts of sebacic acid were dissolved in 385 parts of ethyl alcohol and to this were added 17.8 weight parts of Duomeen S. The Duomeen S- consisted of a mixture of N-alkyl trimethylene diamines derived from technical grade soya acids. The alkyl group content was distributed as follows: C-14, 2%; C-16, 5%; C-18, 93%.

This solution was then heated to evaporate the alcohol and then heated at C. for 2 hours. The soft resinous product obtained was dissolved in an equal weight of liquid epoxide polymer of the type described in Example- I, and the resulting composition exhibited the same water'- cleanability and good-hardening characteristics as the adhesive composition produced in Example].

Epoxy resins containing the hardeners of the present v invention are particularly adapted for use as trowellable grouts or mortars to set ceramic tiles, and to fill the joints between the tiles. When used for this purpose, the epoxy resin compositions form a hard, adherent, chemically resistant joint. These compositions also have the advantage that they cure at room temperature, thereby rendering their use for this purpose especially advantageous.

The epoxy resin compositions using the hardeners of the present invention bondexceedingly well to ceramic tile edges and to the backs of ceramic tile. Additionally, these compositions are flexible, and resistant to moderate temperature change. Also, such compositions are resistant to acidand alkali attack.

These epoxy resin compositions also have the advantage 7 of being readily water-cleanable from the surfaces of the 7 and so forth, to increase the flexibility of the hardened composition.

Pigments and fillers of various types may also be incorporated into'the adhesive compositions. As examples of such fillers may be mentioned blanc fixe, sand, talc, pyrophyllite, various clays, diatomaceous earth, and other like materials. The fillers are preferably in a fine state of subdivision, and have high surface areas.

Coloring materials may be added to the adhesive composition if desired. The coloring materials include organic and inorganic coloring materials. As examples may be mentioned titanium dioxide, carbon black, cadmium red, Blue Lake (13% Ponsal Blue, aluminum hydrate and 77 percent blanc fixe)-Krebs BP-l79-D, Blue Lake Krebs BP-258-D, Lithol Tower, Chrome Yellow, Iron Blue, Milari Blue, Monastral Green, Maroon Toner, chrome green, chrome orange, iron oxide reds, aluminum powder, and flatting agents like diatomaceous silica and silica aerogel. The coloring materials should be selected, however, so as to be non-reactive with the epoxy resins and other ingredients at atmospheric temperature, as otherwise this might cause poor storage stability and also affect the retention of adhesiveness.

The adhesive compositions of the present invention may also have incorporated therein, if desired, a lubricant, such as silicone oils, silicone jelly, petroleum jellies, and so forth. As an example of the silicone oil may be mentioned organo-siloxane liquid supplied as Silicone Liquid No. 81069. Any of the commercially available silicone jellies which are sold under a wide variety of trademarks and tradenames may be used.

The following examples are illustrative of bonding compositions using the epoxy resins and the hardeners of the present invention.

Example VIII A resin base and pigment hardening composition were prepared using the following formulae.

The resin base:

28.9 weight parts epoxide resin 14.3 weight parts titanium dioxide pigment 11.4 weight parts polystyrene resin 45.4 weight parts blanc fixe Pigment-hardener composition:

28.0 weight parts amide-amino tall oil resin 1.7 weight parts diethylene triamine 68.5 weight parts blanc fixe 1.8 weight parts silica aerogel It will be noted that the hardener portion of this example contains a polyamine in free amine form, i.e., diethylenetriamine- The epoxide resin used was of the epichlorohydrinbisphenol of acetone type described in Example 1. The amide-amino tall oil resin was that produced in Example IV by the reaction of dimerized tall oil with excess tetraethylene pentamine at a temperature of 155 C.

The resin base and pigment-hardener composition were mixed, and a smooth, white, easily spreadable composition was produced. The composition was trowelled over a wall surface of glazed ceramic tiles. The joints between the tiles were thus filled with this grouting composition. Excess material was removed from the face of the tiles by scraping with the trowel edgeand then wiped clean :with a water-soaked cotton cloth. A smooth, hard, impermeable grout joint was thus obtained.

Example IX The following resin-base was prepared:

63.5 weight parts of epoxide resin 5.5 weight parts of phenyl glycidyl ether 1.3 weight parts 2,2-bis(4-hydroxyphenyl) propane 26.7 weight parts of polystyrene resin 3.0 weight parts of petroleum jelly and mixed with 3.33 times its weight of the following filler-hardener composition:

11.2 weight parts amido-amino tall oil resin, equivalent weight of 135, viscosity at 25 C. of 250 centipoises 0.35 weight part diethylene triamine 85.6 weight parts sand (through '30 mesh screen) 2.8 weight parts silica aerogel .05 weight part carbon black It will be noted that the hardener portion of this example contains a polyamine in free amine form, i.e., diethylenetriamine.

The epoxide resin was of the solid type described in Example VI. It had an epoxide equivalent of about 500, a viscosity of approximately 7,000 centipoises (25 C.), and a melting point of about 42 C.

The poly-amido-amino tall oil resin was produced according to the procedure of Example IV by reacting dimerized tall oil resin with excess tetraethylene pentamine (based upon the stoichiometric amount of a tall oil resin), at a temperature of C.

This gave a trowellable composition that was used to set ceramic quarry tiles, and to subsequently fill the joints between these. Excess material was removed from the tile face by mopping with a sponge wet with water. A hard, adherent, chemically resistant joint was obtained.

Example X The composition of Example VIII was used to set ceramic tile over a wet concrete floor. A strong bond was obtained despite the wetness of this'subsurface.

Example XI The composition of Example VIII was used to patch the eroded joints of a ceramic tile floor that had been in service for some years in a dairy cooler room. Although these open joints were soaked with water and detergents draining from sinks in this area, full, hard, and durable joints were obtained;

. Example XII This example was run for comparison with Example A resin base and pigment hardening composition are prepared using the formulae of Example VIII, with the exception that in the pigment hardening composition 28.0 weight parts of tetraethylene pentamine are substituted for the 28.0 parts of amido-amino tall oil resin.

The resin base and pigment-hardener composition are mixed, and a smooth, white composition was obtained. The composition is trowelled over a wall surface of ceramic tiles. The joints between the tiles are thus filled with the grouting composition.

Excess material is removed from the face of the tiles by scraping with the trowel edge and the faces are then wiped with a water-soaked cotton cloth. Upon continued rubbing, it is found that the remaining composition cannot be removed from the face of the tile.

The composition of Example XII is used to set ceramic tile over a wet concrete floor. The bond obtained after setting is quite weak, and the tiles can easily be displaced and removed from the floor.

The composition of Example XII is also used to patch eroded joints of a ceramic tile floor that has been in service for some years in a dairy cooler room." Full, hard and durable joints are not obtained, owing to the fact that the joints are soaked with water and detergent draining from sinks in the area.

The invention in its broader aspects is not limited to the specific steps, methods, compositions and improvements shown and described herein, but departures may be made within the scope of the accompanying claims without departing from the principles of the invention and without sacrificing its chief advantages.

What is claimed:

1. A two-part adhesive bonding composition comprising a resin base portion and a filler hardener portion; said resin base portion comprising an epoxy resinous material containing terminal epoxy groups; said' filler hardener portion comprising a poly-amido-amine having an equivalent weight of 135, said resin portion and said hardener portion when admixed producing an adhesive composition which is water cleanable and which is capable of curing to a hard, adherent, chemical resistant bond at room temperature in the presence of water.

2. The adhesive bonding composition of claim 1 wherein the poly-amido-amine is formed by reacting a polycarboxylic acid compound corresponding to the formula R(CO H),,, wherein R is a hydrocarbon radical and rt is an integer having a value of at least two, with a stoichiometric excess of polyamine compound having at least two amino nitrogen atoms. 3. An adhesive bonding composition comprising, in

admixture, a resin base and a hardener, said resin base comprising an epoxy resinous material containing terminal epoxy groups derived from a polyhydric phenol and epichlorohydrin; said hardener comprising a poly-amido- W amine having an equivalent weight of 135, said adhesive composition ,being water cleanable and being capable of curing to a hard, adherent, chemical resistant bond at room temperature in the presence of water.

4. The adhesive bonding composition of claim 3 wherein the poly-amido -a'mine is formed by reacting a polycarboxylic acid compound corresponding to the formula R(COOH),,, wherein R is a hydrocarbon radical and n is an integer having a value of at least two, with a stoichiometric excess of polyamine compound having at least two amino nitrogen atoms.

5. A method of producing a water cleanable adhesive composition capable of curing to a hard, chemical resistant bond at room temperature in the presence of water, which comprises establishing a resin base and a hardener therefor; said resin base comprising an epoxy resinous material containing terminal epoxy groups; said hardener comprising a poly-amido'amine having an equivalent weight of 135; and admixing said resin base and hardener.

6. The adhesive bonding composition of claim 5 wherein the poly-amido-amine is formed by reacting a polycarboxylic acid compound corresponding to the formula .R(COOH),,, wherein R is a hydrocarbon radical and f n is an integer having a value of at least two, with a stoichiometric excess of polyamine compound having at least two amino nitrogen atoms.

7. A method of producing a water cleanable adhesive composition capable of curing to a hard, chemical resistant bond at room temperature in the presence of water which comprises establishing a resin base and a hardener there- 7 for; said resin base comprising an epoxy resinous material containing terminal" epoxy groups, and derived from a polyhydric phenol and epichlorohydrin; said hardener comprising a poly-amido-amine hardener having an equivalent weight of 135, and admixing said resin base and hardener.

8. The adhesive bonding composition of claim 7 wherein the poly-amido-amine is formed by reacting a polycarboxylic acid compound corresponding to the formula R(COOH),,, wherein R is a hydrocarbon radical and n is an integer having a value of at least two, with a stoichiometric excess of polyamine compound having at v least two amino nitrogen atoms. a 1

weight of 13S and being the reaction product of a polycarboxylic acid corresponding to the formula R(COOH),,, wherein R is a hydrocarbon radical and n is an integer having a value of at least 2, and a stoichiometric excess of a polyamine having at least two amino nitrogen atoms; said epoxy resin portion and hardener portion when admixed producing an adhesive composition which is water cleanable and which is capable of curing to a hard, adherent chemical resistant bond at room temperature and in thepresence of water.

10. The adhesive bonding composition of claim 9 wherein the polycarboxylic acid comprises dimerized diterpene acids having a formula weight of about 300 to 900.

11. A two-part adhesive bonding composition comprising a resin base portion and a filler hardener portion; said resin base portion comprising: a liquid epoxy resinous.

material containing terminal epoxy groups derived from a polyhydric phenol and epichlorohydrin, polystyrene resin, and a finely divided, solid inert aggregate; said filler hardener portion comprising a poly-amido-amine hardener, and an inert aggregate, said poly-amido-amine epoxy hardener having an equivalent weight of and being the reaction product of a polycarboxylic acid corresponding to the formula R(COOH) wherein R is a hydrocarbon radical and n is an integer having a value of at least 2, and a stoichiometric excess of a polyamine compound having at least two amino nitrogens; said resin portion and hardener portion when admixed producing an adhesive composition which is water cleanable and which 63.5 weight parts of solid epoxy resinous material 5.5 weight parts of phenyl glycidyl ether' 1.3 weight parts of 2,2-bis(4-hydroxyphenyl) propane 26.7 weight parts of polystyrene resin 3.0 weight parts of petroleum jelly;

said filler hardener composition portion comprising:

11.2 Weight parts amido-amine tall oil resin 0.35 weight part diethylene triamine 85.6 weight parts sand 2.8 weight parts silica aerogel .05 weight part carbon black;

said epoxy resinous material containing terminal epoxy groups derived from a polyhydric phenol and epichlorohydrin; said amido-amine tall oil resin having an equivalent weight of 135;. said resin portion and hardener portion when admixed producing an adhesive composition which is water cleanable and which is capable of curing to a hard, adherent chemical resistant bond in the presence of water and at room temperature.

14. A two-part adhesive bonding composition comprising a resin base portion and a filler hardener portion;

said resin base portion comprising:

28.9 weight parts liquid epoxy resinous material 14.3 weight parts titanium dioxide pigment 11.4 weight parts polystyrene resin 45.4 weight parts blanc fixe;

and said filler hardener portion comprising:

28.0 weight parts amide-amine tall oil resin 1.7 weight parts diethylene triamine 68.5 weight parts blanc fixe 1.8 weight parts silica aerogel;

said epoxy resinous material containing terminal epoxy groups derived from a polyhydric phenol and epichloro- 1 1' 1 2 hydrin; said amide-amine tall oil resin having an equiv- 2,760,944 8/56 Greenlee 260l8 alent weight of 135; said resin portion and hardener 2,823,189 2/58 Floyd 260l8 portion when admixed producing an adhesive composition 2,899,397 8/59 Aelony et a1 260l8 which is water cleanable and which is capable of ring to 2,909,494 10/59 Parry et al. "260--18 a hard, adherent chemical resistant bond at room mm 5 2,990,333 6/61 Glasser 260l8 pcl'ature in the D of water- 3,051,665 8/ 62 Wismer et a] 2602.5 References Cited by the Examiner 396L773 11/62 Rogler UNITED STATES PATENTS LEON J. BERCOVI'TZ, Primary Examiner.

2,450,940 10/48 Cowan et a1. 2604045 10 

1. A TWO-PART ADHESIVE BONDING COMPOSITION COMPRISING A RESIN BASE PORTION AND A FILLER HARDENER PORTION; SAID RESIN BASE PORTION COMPRISING AN EPOXY RESINOUS MATERIAL CONTAINING TERMINAL EPOXY GROUPS; SAID FILLER HARDENER PORTION COMPRISING A POLY-AMIDO-AMINE HAVING AN EQUIVALENT WEIGHT OF 135, SAID RESIN PORTION AND SAID HARDENER PORTION WHEN ADMIXED PRODUCING AN ADHSIVE COMPOSITION WHICH IS WATER CLEANABLE AND WHICH IS CAPABLE OF CURING TO A HARD, ADHERENT, CHEMICAL RESISTANT BOND AT ROOM TEMPERATURE IN THE PRESENCE OF WATER. 